Process Engineer (Plating & Wet)
AGG-J-002 · Semiconductor · In Japan
What you will do
Metal film, plating or wet process work: tool set-up, recipes, wafer measurement and reports.
You need
1 year of fab, cleanroom or process-engineer work. Tool operation and recipe creation.
Helpful
Electro or electroless plating, in-line metrology.
Language
Japanese: not required (wet process). Polishing (CMP) work in this team needs Japanese. For an English-OK CMP role, see AGG-J-016.
Who can apply
This job is only for people who live in Japan now, for example as a student or with a work visa. Every job is in Japan.
Employment
Dispatch via AGG (AGG employs you)
Work style
On-site, in and out of the cleanroom. Day shift. Shifts vary by team and can include weekends.
Salary
¥5.0M–7.0M / year (gross guide, set by experience)
Hiring organization: Fukuyoshi Inc.
Last updated: 2026-10-30. The work location and the company name are given in writing at your first consultation. AGG (Fukuyoshi Inc.) charges candidates no fees.
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Related guides
Semiconductor jobs in Japan in English · From a research cleanroom to a fab job · Dispatch work (haken) in Japan, explained


